Performance Characteristics:
•Neutral curing at room temperature, fast curing rate to boost production efficiency, user-friendly and with excellent self-defoaming capability.
•Maintains rubber elasticity in the range of -40℃ to 250℃ after curing, featuring superior electrical properties and good thermal conductivity.
•Delivers outstanding adhesion to most plastics, rubbers, reinforced PA nylon, polyphenylene oxide (PPO), PVDF and other substrates.
•Relevant SGS and TUV test reports are available, complying with the EU RoHS Directive.
•Non-corrosive to PVC, ABS, PP, aluminum panels and other materials.
SMT-999 PV Junction Box Potting Adhesive is a two-component condensation-cure silicone sealant. It is a white silicone material with proper hardness, flame retardancy and thermal conductivity, and has passed UL94 V-0 and TUV certifications. It cures rapidly at room temperature with no exotherm, no corrosion and low shrinkage during curing. The cured material features excellent electrical properties and good thermal conductivity. It is waterproof, moisture-proof, chemical-resistant, anti-yellowing and capable of resisting weather aging for more than 20 years. It is suitable for thermal conductive sealing and potting of various electronic components to form thermally conductive insulators.
Application Areas
- Potting for junction boxes of photovoltaic modules
- Potting of electronic and electrical components requiring waterproofing, insulation and thermal conductivity
Package
- Part A is packed in 10kg per drum and Part B in 2kg per drum; other package sizes can be customized according to customer requirements.
Before application:
- Compatibility test between potting adhesive and contacting materials as well as adhesion test on target substrates shall be carried out prior to construction.
Construction Method:
- Metering: Accurately weigh Part A and Part B (curing agent) at a weight ratio of 5:1. Before weighing, properly stir Part A to fully disperse settled fillers into the resin base.
- Mixing: Blend Part A and Part B evenly in a mixing tank. Incomplete mixing will impair the appearance and insulating performance of cured compound.
- Potting: Pour the well-mixed compound into target products promptly. Vacuum degassing is recommended prior to potting if high thermal conductivity is required.
- Curing: Leave potted parts to cure at room temperature. They can proceed to the next process after initial set. Complete curing takes around 1 hour under ambient temperature. Curing proceeds faster in hot summer and slower in cold winter.
- Not to be used as structural sealant.
- Not suitable for copper and polycarbonate substrates.
- Do not apply when substrate surface temperature is lower than 5℃ or higher than 40℃.
- Not applicable for frosted, damp areas or locations under continuous water immersion.
- Avoid contact with rubber materials such as rubber strips and rubber spacers to prevent yellowing.
- Avoid contact with acidic or alkaline substances (e.g. exterior wall cleaning agents) to prevent discoloration.
- Unsuitable for all substrates that exude grease, plasticizers or solvents, such as surfaces of oil-impregnated wood.
- Use the product within its shelf life; expired material shall not be used.
- Construction shall be carried out strictly in accordance with the adhesion compatibility test procedure.
- Avoid direct contact with skin and eyes; do not ingest.
- Keep out of reach of children and store in an area inaccessible to minors.
- Trace chemical substances will be released during curing. The working area must be fully ventilated. The fully cured product is non-toxic to human body.
- Ambient temperature and relative humidity have certain influences on the working time (skin-over time) and curing speed of the adhesive. Monitor environmental changes before construction and conduct timely control or parameter adjustment accordingly.